MC0402WGF5111TCE
vs
ES02WGF5111T5E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MULTICOMP PRO
|
ROYAL ELECTRONIC FTY CO LTD
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Construction |
Rectangular
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.35 mm
|
0.35 mm
|
| Package Length |
1 mm
|
1 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.5 mm
|
0.5 mm
|
| Packing Method |
TR
|
TR
|
| Rated Power Dissipation (P) |
0.0625 W
|
0.0625 W
|
| Rated Temperature |
70 °C
|
|
| Resistance |
5110 Ω
|
5110 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0402
|
0402
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
TIN OVER NICKEL
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC0402WGF5111TCE with alternatives
Compare ES02WGF5111T5E with alternatives