MC00625W040213K57 vs HQ02WGF3571TEE feature comparison

MC00625W040213K57 SPC Multicomp

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HQ02WGF3571TEE Royal Electronic Factory (Thailand) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MULTICOMP PRO ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Samacsys Manufacturer Multicomp Pro
Construction Chip Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.35 mm 0.35 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Rated Power Dissipation (P) 0.0625 W 0.0625 W
Rated Temperature 70 °C 70 °C
Resistance 3570 Ω 3570 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 2 1
Packing Method TR
Reference Standard AEC-Q200

Compare MC00625W040213K57 with alternatives

Compare HQ02WGF3571TEE with alternatives