MC00625W040213K57
vs
HQ02WGF3571TEE
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MULTICOMP PRO
ROYAL ELECTRONIC FTY CO LTD
Package Description
CHIP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Samacsys Manufacturer
Multicomp Pro
Construction
Chip
Rectangular
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.35 mm
0.35 mm
Package Length
1 mm
1 mm
Package Style
SMT
SMT
Package Width
0.5 mm
0.5 mm
Rated Power Dissipation (P)
0.0625 W
0.0625 W
Rated Temperature
70 °C
70 °C
Resistance
3570 Ω
3570 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0402
0402
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
50 V
50 V
Base Number Matches
2
1
Packing Method
TR
Reference Standard
AEC-Q200
Compare MC00625W040213K57 with alternatives
Compare HQ02WGF3571TEE with alternatives