MBR230HW
vs
CDBMS230-HF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
COMCHIP TECHNOLOGY CO LTD
|
| Package Description |
LEAD FREE, PLASTIC PACKAGE-2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
FREE WHEELING DIODE
|
|
| Application |
GENERAL PURPOSE
|
FAST RECOVERY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.5 V
|
0.52 V
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-F2
|
| Non-rep Pk Forward Current-Max |
40 A
|
40 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
2 A
|
2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Rep Pk Reverse Voltage-Max |
30 V
|
30 V
|
| Reverse Current-Max |
1000 µA
|
500 µA
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
Tin (Sn)
|
|
|
|
Compare MBR230HW with alternatives
Compare CDBMS230-HF with alternatives