MBM29PL160TD-75PF
vs
MBM29PL160TD-75PF-E1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
SPANSION INC
Part Package Code
SOIC
SOIC
Package Description
PLASTIC, SOP-44
PLASTIC, SOP-44
Pin Count
44
44
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
75 ns
75 ns
Alternate Memory Width
8
8
Boot Block
TOP
TOP
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
28.45 mm
28.45 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
-20 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
13 mm
13 mm
Base Number Matches
3
1
Rohs Code
Additional Feature
ALSO CONFIGURABLE AS 2M X 8
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare MBM29PL160TD-75PF with alternatives
Compare MBM29PL160TD-75PF-E1 with alternatives