MBM29PDS322BE10PBT
vs
AM29DL323DT120WDIN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
PLASTIC, FBGA-63
Pin Count
63
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
100 ns
120 ns
Boot Block
BOTTOM
TOP
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
11 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
63
63
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
2.2 V
Supply Voltage-Min (Vsup)
1.8 V
Supply Voltage-Nom (Vsup)
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
7 mm
Base Number Matches
3
3
Rohs Code
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
8,63
Package Equivalence Code
BGA63,8X12,32
Power Supplies
3/3.3 V
Ready/Busy
YES
Sector Size
8K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.045 mA
Toggle Bit
YES
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