MBM29LV400TC-55PW vs MBM29LV400BC-55PW feature comparison

MBM29LV400TC-55PW FUJITSU Semiconductor Limited

Buy Now Datasheet

MBM29LV400BC-55PW FUJITSU Semiconductor Limited

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code BGA BGA
Package Description PLASTIC, SCSP-48 PLASTIC, SCSP-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Additional Feature MINIMUM 100000 PROGRAM/ERASE CYCLES MINIMUM 100000 PROGRAM/ERASE CYCLES
Alternate Memory Width 8 8
Boot Block TOP BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 4.67 mm 4.67 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 3.52 mm 3.52 mm
Base Number Matches 4 4

Compare MBM29LV400TC-55PW with alternatives

Compare MBM29LV400BC-55PW with alternatives