MBM29LV400BC-70PBT
vs
M29W400DT70ZE6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
PLASTIC, FBGA-48
6 X 8 MM, 0.80 MM PITCH, TFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
MINIMUM 100000 PROGRAM/ERASE CYCLES
TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
TOP
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
4
Rohs Code
Command User Interface
YES
Data Polling
YES
JESD-609 Code
e0
Number of Sectors/Size
1,2,1,7
Package Equivalence Code
BGA48,6X8,32
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
Compare MBM29LV400BC-70PBT with alternatives
Compare M29W400DT70ZE6 with alternatives