MBM29LV160TE70PBT-E1 vs M29W160ET80ZA3F feature comparison

MBM29LV160TE70PBT-E1 Spansion

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M29W160ET80ZA3F Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, TFBGA,
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature ALSO CONFIGURABLE AS 2M X 8
Alternate Memory Width 8 8
Boot Block TOP TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 1 2
Rohs Code Yes

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Compare M29W160ET80ZA3F with alternatives