MBM29LV160TE-70PBT
vs
S29AL016D70BAN012
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
VFBGA, BGA48,6X8,32
Pin Count
48
48
Reach Compliance Code
unknown
not_compliant
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8.15 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
6.15 mm
Base Number Matches
2
3
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.51
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Sectors/Size
1,2,1,31
Package Equivalence Code
BGA48,6X8,32
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.035 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
Type
NOR TYPE
Compare MBM29LV160TE-70PBT with alternatives
Compare S29AL016D70BAN012 with alternatives