MBM29LV160BE70PBT
vs
HY29DL163BF-80
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
SK HYNIX INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, FBGA-48
8 X 9 MM, FBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
80 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Length
8 mm
9 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
1,2,1,31
8,31
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
16K,8K,32K,64K
8K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.035 mA
0.045 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
8 mm
Base Number Matches
2
2
Compare MBM29LV160BE70PBT with alternatives
Compare HY29DL163BF-80 with alternatives