MBM29LV002BC-90PTN
vs
AM29LV002BB-90EI
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
SPANSION INC
|
| Part Package Code |
TSOP1
|
TSOP1
|
| Package Description |
PLASTIC, TSOP1-40
|
TSSOP, TSSOP40,.8,20
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
MINIMUM 100000 PROGRAM/ERASE CYCLES
|
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-PDSO-G40
|
R-PDSO-G40
|
| Length |
18.4 mm
|
18.4 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Command User Interface |
|
YES
|
| Data Polling |
|
YES
|
| Data Retention Time-Min |
|
20
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
1,2,1,3
|
| Package Equivalence Code |
|
TSSOP40,.8,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
16K,8K,32K,64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.03 mA
|
| Terminal Finish |
|
TIN LEAD
|
| Toggle Bit |
|
YES
|
|
|
|
Compare MBM29LV002BC-90PTN with alternatives
Compare AM29LV002BB-90EI with alternatives