MBM29F800BA-55PFTR
vs
M29F800FB55N6E2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
MICRON TECHNOLOGY INC
Part Package Code
TSOP1
Package Description
PLASTIC, REVERSE, TSOP1-48
TSOP1,
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
55 ns
55 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
18.4 mm
18.4 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1-R
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
12 mm
12 mm
Base Number Matches
4
2
Rohs Code
Yes
Additional Feature
BOTTOM BOOT BLOCK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MBM29F800BA-55PFTR with alternatives
Compare M29F800FB55N6E2 with alternatives