MBM29F800BA-55PFTR vs M29F800FB55N6E2 feature comparison

MBM29F800BA-55PFTR FUJITSU Semiconductor Limited

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M29F800FB55N6E2 Micron Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC MICRON TECHNOLOGY INC
Part Package Code TSOP1
Package Description PLASTIC, REVERSE, TSOP1-48 TSOP1,
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 55 ns 55 ns
Alternate Memory Width 8 8
Boot Block BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm 12 mm
Base Number Matches 4 2
Rohs Code Yes
Additional Feature BOTTOM BOOT BLOCK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MBM29F800BA-55PFTR with alternatives

Compare M29F800FB55N6E2 with alternatives