MBM29F200BC-55PF
vs
M29F200FB55M6T2
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, SOP-44
|
SOP,
|
| Pin Count |
44
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
55 ns
|
55 ns
|
| Additional Feature |
CONFIGURABLE AS 128K X 16; 100000 WRITE/ERASE CYCLES MIN
|
BOTTOM BOOT BLOCK
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM
|
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| Length |
28.45 mm
|
28.5 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.5 mm
|
3 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
|
| Width |
13 mm
|
12.6 mm
|
| Base Number Matches |
4
|
2
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare MBM29F200BC-55PF with alternatives
Compare M29F200FB55M6T2 with alternatives