MBM29F002TC-70PD vs MBM29F002BC-70PD-E1 feature comparison

MBM29F002TC-70PD FUJITSU Semiconductor Limited

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MBM29F002BC-70PD-E1 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code QFJ QFJ
Package Description PLASTIC, LCC-32 PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature 100000 WRITE/ERASE CYCLES MIN
Boot Block TOP BOTTOM
JESD-30 Code R-PQCC-J32 R-PQCC-J32
Length 13.97 mm 13.97 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm 3.56 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Type NOR TYPE NOR TYPE
Width 11.43 mm 11.43 mm
Base Number Matches 4 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MBM29F002TC-70PD with alternatives

Compare MBM29F002BC-70PD-E1 with alternatives