MBM29F002TC-55PFTN-E1 vs M29F002BT55N3F feature comparison

MBM29F002TC-55PFTN-E1 Spansion

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M29F002BT55N3F STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description PLASTIC, TSOP1-32 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Boot Block TOP TOP
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 18.4 mm 18.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Type NOR TYPE NOR TYPE
Width 8 mm 8 mm
Base Number Matches 1 2
Rohs Code Yes
Additional Feature TOP BOOT BLOCK
Command User Interface YES
Data Polling YES
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3/e6
Number of Sectors/Size 1,2,1,3
Package Equivalence Code TSSOP32,.8,20
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Terminal Finish TIN/TIN BISMUTH
Toggle Bit YES

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