MBM29DS163BE12PBT
vs
AM29DS163DB120WAF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FUJITSU LTD
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA, BGA48,6X8,32
|
,
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
120 ns
|
|
| Additional Feature |
CONFIGURABLE AS 2M X 8
|
|
| Alternate Memory Width |
8
|
|
| Boot Block |
BOTTOM
|
|
| Command User Interface |
YES
|
|
| Common Flash Interface |
YES
|
|
| Data Polling |
YES
|
|
| JESD-30 Code |
R-PBGA-B48
|
|
| JESD-609 Code |
e0
|
|
| Length |
8 mm
|
|
| Memory Density |
16777216 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
8,31
|
|
| Number of Terminals |
48
|
|
| Number of Words |
1048576 words
|
|
| Number of Words Code |
1000000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1MX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFBGA
|
|
| Package Equivalence Code |
BGA48,6X8,32
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
1.8 V
|
|
| Qualification Status |
Not Qualified
|
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
1.2 mm
|
|
| Sector Size |
8K,64K
|
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.025 mA
|
|
| Supply Voltage-Max (Vsup) |
2.2 V
|
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
|
| Supply Voltage-Nom (Vsup) |
2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
|
| Width |
6 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
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