MBM29DL640E90PBT
vs
S29JL064H90BAI000
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
PLASTIC, FBGA-63
12 X 11 MM, FPBGA-63
Pin Count
63
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
e0
Length
11 mm
12 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
16,126
Number of Terminals
63
63
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA63,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
8K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.058 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
10 mm
11 mm
Base Number Matches
3
3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
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