MBM29DL322BD90PBT
vs
MBM29DL323BD90PBT-E1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
57
57
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B57
R-PBGA-B57
Length
13.95 mm
13.95 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
57
57
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
7.95 mm
7.95 mm
Base Number Matches
3
1
Rohs Code
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare MBM29DL322BD90PBT with alternatives
Compare MBM29DL323BD90PBT-E1 with alternatives