MBM27C1024A-12P vs MX27C1024DC-12 feature comparison

MBM27C1024A-12P FUJITSU Semiconductor Limited

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MX27C1024DC-12 Macronix International Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC MACRONIX INTERNATIONAL CO LTD
Package Description WDIP, CERAMIC, DIP-40
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 120 ns 120 ns
Additional Feature TTL COMPATIBLE INPUT & OUTPUT LEVELS QUICK PULSE PROGRAMMING ALGORITHM
JESD-30 Code R-GDIP-T40 R-GDIP-T40
Length 52.07 mm 52.07 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm 5.7912 mm
Supply Current-Max 0.05 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1
Rohs Code No
Part Package Code DIP
Pin Count 40
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP40,.6
Standby Current-Max 0.0001 A
Terminal Finish TIN LEAD

Compare MBM27C1024A-12P with alternatives

Compare MX27C1024DC-12 with alternatives