MBM27C1000-15Z
vs
5962-8961405XA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
WAFERSCALE INTEGRATION INC
|
| Part Package Code |
DIP
|
|
| Package Description |
,
|
0.600 INCH, WINDOWED, CERDIP-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.71
|
8542.32.00.61
|
| Base Number Matches |
2
|
4
|
| Access Time-Max |
|
150 ns
|
| JESD-30 Code |
|
R-GDIP-T32
|
| JESD-609 Code |
|
e0
|
| Length |
|
42.295 mm
|
| Memory Density |
|
1048576 bit
|
| Memory IC Type |
|
UVPROM
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Number of Words |
|
131072 words
|
| Number of Words Code |
|
128000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
128KX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
WDIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE, WINDOW
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.72 mm
|
| Supply Current-Max |
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
15.24 mm
|
|
|
|
Compare MBM27C1000-15Z with alternatives
Compare 5962-8961405XA with alternatives