MBM10A474-3CZ
vs
AM9151-50/BLA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
50 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
30.3 mm
31.9405 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
55 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX4
1KX4
Output Characteristics
OPEN-EMITTER
3-STATE
Output Enable
NO
YES
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
5.08 mm
Surface Mount
NO
NO
Technology
TTL
NMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
DIP24,.3
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
TIN LEAD
Compare MBM10A474-3CZ with alternatives
Compare AM9151-50/BLA with alternatives