MBJCU31LBB7474KTPA18
vs
CL31B474KBHWPNL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TAIYO YUDEN CO LTD
SAMSUNG ELECTRO-MECHANICS
Package Description
CHIP
, 1206
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Capacitance
0.47 µF
0.47 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
1.6 mm
1.6 mm
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, EMBOSSED, 7 INCH
TR, CARDBOARD, 13 INCH
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
50 V
50 V
Size Code
1206
1206
Surface Mount
YES
YES
Temperature Characteristics Code
X7R
X7R
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
1.6 mm
1.6 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e3
Reference Standard
AEC-Q200
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Compare MBJCU31LBB7474KTPA18 with alternatives
Compare CL31B474KBHWPNL with alternatives