MBASU32MAB7106KPNA18
vs
C3225X7R1H106K250AC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TAIYO YUDEN CO LTD
TDK CORP
Package Description
CHIP
CHIP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Capacitance
10 µF
10 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.5 mm
2.5 mm
Length
3.2 mm
3.2 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
10%
10%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Packing Method
TR, EMBOSSED, 7 INCH
TR, 7 Inch
Positive Tolerance
10%
10%
Rated (DC) Voltage (URdc)
50 V
50 V
Size Code
1210
1210
Surface Mount
YES
YES
Temperature Characteristics Code
X7R
X7R
Temperature Coefficient
15% ppm/°C
15% ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.5 mm
2.5 mm
Base Number Matches
1
1
Factory Lead Time
16 Weeks, 4 Days
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Compare MBASU32MAB7106KPNA18 with alternatives
Compare C3225X7R1H106K250AC with alternatives