MBASU31LSB7225KTNA18 vs C3216X7R1H225K160AB feature comparison

MBASU31LSB7225KTNA18 TAIYO YUDEN

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C3216X7R1H225K160AB TDK Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TAIYO YUDEN CO LTD TDK CORP
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Capacitance 2.2 µF 2.2 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.6 mm 1.6 mm
Length 3.2 mm 3.2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 10% 10%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, EMBOSSED, 7 INCH TR, 7 Inch
Positive Tolerance 10% 10%
Rated (DC) Voltage (URdc) 50 V 50 V
Size Code 1206 1206
Surface Mount YES YES
Temperature Characteristics Code X7R X7R
Temperature Coefficient 15% ppm/°C 15% ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.6 mm 1.6 mm
Base Number Matches 1 2
Pbfree Code Yes
Factory Lead Time 16 Weeks, 4 Days
JESD-609 Code e3
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier

Compare MBASU31LSB7225KTNA18 with alternatives

Compare C3216X7R1H225K160AB with alternatives