MB96F6B6RBPMC-GSE1
vs
MB96F6B6RBPMC-GSE2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
FUJITSU LTD
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
16
16
CPU Family
F2MC-16F
F2MC-16F
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Number of Terminals
100
100
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP100,.63SQ,20
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
16384
16384
ROM (words)
147712
147712
ROM Programmability
FLASH
FLASH
Speed
32 MHz
32 MHz
Supply Current-Max
39.5 mA
39.5 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
1
Package Description
QFP, QFP100,.63SQ,20
Has ADC
YES
Address Bus Width
Clock Frequency-Max
8 MHz
DAC Channels
NO
DMA Channels
YES
External Data Bus Width
Length
14 mm
Number of I/O Lines
79
On Chip Program ROM Width
8
PWM Channels
YES
Supply Voltage-Max
5.5 V
Supply Voltage-Min
2.7 V
Supply Voltage-Nom
5 V
Width
14 mm
Compare MB96F6B6RBPMC-GSE1 with alternatives
Compare MB96F6B6RBPMC-GSE2 with alternatives