MB96F348HSCPMC-GSE2
vs
MB96F345FSPMC-GSE2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LFQFP-100
|
14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
CPU Family |
F2MC-16F
|
|
Clock Frequency-Max |
56 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
Length |
14 mm
|
14 mm
|
Number of I/O Lines |
80
|
82
|
Number of Terminals |
100
|
100
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
105 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP100,.63SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
24576
|
|
ROM (words) |
294912
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Speed |
56 MHz
|
56 MHz
|
Supply Current-Max |
65 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3.3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MB96F348HSCPMC-GSE2 with alternatives
Compare MB96F345FSPMC-GSE2 with alternatives