MB96F346YWBPMC-GSE2
vs
MB96F345DWPMC-GSE2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
| Package Description |
LFQFP,
|
14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-100
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
56 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
80
|
80
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
105 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| ROM (words) |
147456
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
56 MHz
|
56 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
100
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MB96F346YWBPMC-GSE2 with alternatives
Compare MB96F345DWPMC-GSE2 with alternatives