MB89P808PF vs MB89P808PF feature comparison

MB89P808PF FUJITSU Semiconductor Limited

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MB89P808PF Spansion

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Pbfree Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code QFP
Package Description QFP, ,
Pin Count 100
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO
Additional Feature ALSO OPERATES AT 2.7V MINIMUM SUPPLY
Address Bus Width
Bit Size 8
Clock Frequency-Max 10 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PQFP-G100
Length 20 mm
Number of I/O Lines 32
Number of Terminals 100
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape RECTANGULAR
Package Style FLATPACK
Qualification Status Not Qualified
ROM Programmability OTPROM
Seated Height-Max 3.35 mm
Speed 10 MHz
Supply Voltage-Max 6 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Rohs Code No
ROM (words) 49152