MB89P808PF
vs
MB89P808PF
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
Package Description
QFP,
Pin Count
100
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
ALSO OPERATES AT 2.7V MINIMUM SUPPLY
Address Bus Width
15
Bit Size
8
8
Clock Frequency-Max
10 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
20 mm
Number of I/O Lines
32
32
Number of Terminals
100
100
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
OTPROM
UVPROM
Seated Height-Max
3.35 mm
Speed
10 MHz
10 MHz
Supply Voltage-Max
6 V
6 V
Supply Voltage-Min
4.5 V
2.2 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
2
Rohs Code
CPU Family
F2MC-8L
Package Equivalence Code
QFP100,.7X.9
RAM (bytes)
2048
ROM (words)
49152
Supply Current-Max
20 mA