MB89P808PF
vs
MB89P808PF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP, QFP100,.7X.9
|
QFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
ALSO OPERATES AT 2.2V MINIMUM SUPPLY
|
ALSO OPERATES AT 2.7V MINIMUM SUPPLY
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
F2MC-8L
|
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
20 mm
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP100,.7X.9
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
|
| ROM (words) |
49152
|
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
3.35 mm
|
3.35 mm
|
| Speed |
10 MHz
|
10 MHz
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage-Max |
6 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
|
|
|