MB89673PF
vs
MB89673PF
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
FUJITSU LTD
|
Package Description |
PLASTIC, QFP-80
|
QFP, QFP80,.7X.9,32
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
10 MHz
|
10 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
JESD-609 Code |
e0
|
e0
|
Length |
20 mm
|
20 mm
|
Number of I/O Lines |
69
|
69
|
Number of Terminals |
80
|
80
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
MROM
|
MROM
|
Seated Height-Max |
3.35 mm
|
3.35 mm
|
Speed |
10 MHz
|
10 MHz
|
Supply Voltage-Max |
6 V
|
6 V
|
Supply Voltage-Min |
2.2 V
|
2.2 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
80
|
CPU Family |
|
F2MC-8L
|
On Chip Program ROM Width |
|
8
|
Package Equivalence Code |
|
QFP80,.7X.9,32
|
RAM (bytes) |
|
384
|
ROM (words) |
|
8192
|
Supply Current-Max |
|
20 mA
|
|
|
|