MB89537CP
vs
MB89537CP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FUJITSU LTD
|
SPANSION INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
SDIP, SDIP64,.75
|
SDIP,
|
Pin Count |
64
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO OPERATES AT 2.2V MINIMUM SUPPLY
|
ALSO OPERATES AT 2.2V MINIMUM SUPPLY
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
F2MC-8L
|
|
Clock Frequency-Max |
12.5 MHz
|
12.5 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T64
|
R-PDIP-T64
|
Length |
58 mm
|
58 mm
|
Number of I/O Lines |
53
|
53
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
SDIP
|
Package Equivalence Code |
SDIP64,.75
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
|
ROM (words) |
32768
|
|
ROM Programmability |
MROM
|
MROM
|
Seated Height-Max |
5.65 mm
|
5.65 mm
|
Speed |
12.5 MHz
|
12.5 MHz
|
Supply Current-Max |
10 mA
|
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.778 mm
|
1.778 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
19.05 mm
|
19.05 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
6
|
6
|
Pbfree Code |
|
No
|
|
|
|