MB8516S064CZ-103LDG
vs
M364C1680CJ0-C60
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
DIMM
Package Description
,
DIMM, DIMM168
Pin Count
168
168
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
FAST PAGE
Access Time-Max
6 ns
60 ns
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX64
16MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM168
Refresh Cycles
8192
Standby Current-Max
0.03 A
Supply Current-Max
1.76 mA
Terminal Pitch
1.27 mm
Compare MB8516S064CZ-103LDG with alternatives
Compare M364C1680CJ0-C60 with alternatives