MB8508S064CG-100DG
vs
HB56S864ES-8B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
HITACHI LTD
Part Package Code
DIMM
Package Description
,
DIMM, DIMM168
Pin Count
168
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FAST PAGE WITH EDO
Access Time-Max
8.5 ns
80 ns
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
536870912 bit
536870912 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
EDO DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX64
8MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
3 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Additional Feature
RAS ONLY/CAS BEFORE RAS REFRESH
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM168
Refresh Cycles
4096
Standby Current-Max
0.096 A
Supply Current-Max
1.424 mA
Terminal Pitch
1.27 mm
Compare MB8508S064CG-100DG with alternatives
Compare HB56S864ES-8B with alternatives