MB84VD22386EJ-85-PBS-E1
vs
AM41DL6408H70FT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
LFBGA,
Pin Count
71
73
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
FCRAM IS ORGANIZED AS 1M X 16; IT ALSO REQUIRES 2.7V TO 3.1V SUPPLY FOR FCRAM
STATIC RAM IS ORGANIZED AS 1M X 8 / 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8
JESD-30 Code
R-PBGA-B71
R-PBGA-B73
JESD-609 Code
e1
e1
Length
11 mm
11.6 mm
Memory Density
33554432 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
71
73
Number of Words
2097152 words
4194304 words
Number of Words Code
2000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-40 °C
Organization
2MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
8 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Compare MB84VD22386EJ-85-PBS-E1 with alternatives
Compare AM41DL6408H70FT with alternatives