MB84VD22386EJ-85-PBS vs IS71VPCF32CS04-7085BI feature comparison

MB84VD22386EJ-85-PBS FUJITSU Limited

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IS71VPCF32CS04-7085BI Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FUJITSU LTD INTEGRATED SILICON SOLUTION INC
Package Description TFBGA, BGA71,8X12,32 8 X 11.60 MM, 0.80 MM PITCH, FBGA-73
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 85 ns
Additional Feature FCRAM IS ORGANISED AS 1M X 16 AND OPERATES AT 2.7V TO 3.1V SUPPLY SRAM ORGANISATION IS 256K X 16/512K X 8
JESD-30 Code R-PBGA-B71 R-PBGA-B73
JESD-609 Code e0 e0
Length 11 mm 11.6 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 71 73
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA71,8X12,32 BGA73,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.053 mA 0.053 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Pin Count 73

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Compare IS71VPCF32CS04-7085BI with alternatives