MB84VD22386EJ-85-PBS
vs
AM41PDS3228DB11IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
FUJITSU LTD
SPANSION INC
Package Description
TFBGA, BGA71,8X12,32
8 X 11.60 MM, FBGA-73
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
85 ns
110 ns
Additional Feature
FCRAM IS ORGANISED AS 1M X 16 AND OPERATES AT 2.7V TO 3.1V SUPPLY
SRAM IS ORGANISED AS 512K X 16/1M X 8
JESD-30 Code
R-PBGA-B71
R-PBGA-B73
JESD-609 Code
e0
e0
Length
11 mm
11.6 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
71
73
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA71,8X12,32
BGA73,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Standby Current-Max
0.000005 A
Supply Current-Max
0.053 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.3 V
2.2 V
Supply Voltage-Min (Vsup)
2.7 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
73
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare MB84VD22386EJ-85-PBS with alternatives
Compare AM41PDS3228DB11IT with alternatives