MB84VD22280FE-70PBS
vs
MB84VD22190FM-70PBS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FUJITSU LTD
FUJITSU LTD
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA59,8X10,32
LFBGA, BGA59,8X10,32
Pin Count
59
59
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
70 ns
Additional Feature
SRAM IS ORGANIZED AS 512K X 16
SRAM IS ORGANIZED AS 256K X 16
JESD-30 Code
R-PBGA-B59
R-PBGA-B59
JESD-609 Code
e0
e0
Length
9 mm
9 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
59
59
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-30 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA59,8X10,32
BGA59,8X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.24 mm
Standby Current-Max
0.000005 A
0.00001 A
Supply Current-Max
0.053 mA
0.043 mA
Supply Voltage-Max (Vsup)
3.1 V
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
7 mm
Base Number Matches
1
1
Compare MB84VD22280FE-70PBS with alternatives
Compare MB84VD22190FM-70PBS with alternatives