MB84VD22184EE-90-PBS vs AM41DL1634DT70IT feature comparison

MB84VD22184EE-90-PBS FUJITSU Semiconductor Limited

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AM41DL1634DT70IT Spansion

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Pbfree Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 11 MM, FBGA-69
Pin Count 73 69
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature 256K X 16 SRAM ALSO AVAILABLE STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 2M X 8
JESD-30 Code R-PBGA-B73 R-PBGA-B69
Length 11.6 mm 11 mm
Memory Density 33554432 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 73 69
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 2MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 2
Rohs Code No
Access Time-Max 70 ns
JESD-609 Code e0
Mixed Memory Type FLASH+SRAM
Moisture Sensitivity Level 3
Package Equivalence Code BGA69,10X10,32
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.045 mA
Terminal Finish TIN LEAD

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