MB84VD21094EM-70PBS vs SST34HF3223B-90-4C-LP feature comparison

MB84VD21094EM-70PBS FUJITSU Limited

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SST34HF3223B-90-4C-LP Silicon Storage Technology

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FUJITSU LTD SILICON STORAGE TECHNOLOGY INC
Package Description TFBGA, BGA56,8X8,32 LFBGA, BGA56,8X8,32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 90 ns
Additional Feature SRAM IS ORGANIZED AS 128K X 16/256K X 8 ALSO CONTAINS (256K X 8/ 128K X 16-BIT) SRAM
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0
Length 7.2 mm 12 mm
Memory Density 16777216 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Standby Current-Max 0.000004 A 0.00004 A
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 10 mm
Base Number Matches 4 1
Part Package Code BGA
Pin Count 56

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Compare SST34HF3223B-90-4C-LP with alternatives