MB84
vs
GBPC608
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
SANGDEST MICROELECTRONICS (NANJING) CO LTD
Package Description
CERAMIC, BR-6, 4 PIN
PLASTIC, KBPC-6, 4 PIN
Pin Count
4
Manufacturer Package Code
BR-6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Configuration
BRIDGE, 4 ELEMENTS
BRIDGE, 4 ELEMENTS
Diode Element Material
SILICON
SILICON
Diode Type
BRIDGE RECTIFIER DIODE
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
1 V
JESD-30 Code
S-CUFM-W4
S-PUFM-W4
JESD-609 Code
e0
Non-rep Pk Forward Current-Max
125 A
160 A
Number of Elements
4
4
Number of Phases
1
1
Number of Terminals
4
4
Operating Temperature-Max
150 °C
Output Current-Max
8 A
6 A
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLANGE MOUNT
FLANGE MOUNT
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
400 V
800 V
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
UPPER
UPPER
Base Number Matches
5
9
Rohs Code
Breakdown Voltage-Min
800 V
Case Connection
ISOLATED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reference Standard
UL RECOGNIZED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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