MB8281-15Z vs D2164A-15 feature comparison

MB8281-15Z FUJITSU Semiconductor Limited

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D2164A-15 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC INTEL CORP
Package Description DIP, HERMETIC SEALED, CERAMIC, DIP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode STATIC COLUMN PAGE
Access Time-Max 150 ns 150 ns
Additional Feature RAS ONLY REFRESH RAS ONLY/HIDDEN REFRESH
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.585 mm 19.558 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STATIC COLUMN DRAM PAGE MODE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 128 128
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
I/O Type SEPARATE
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP16,.3
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

Compare MB8281-15Z with alternatives

Compare D2164A-15 with alternatives