MB81C4256A-80C
vs
KM44C266CP-8
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP20(UNSPEC)
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Time-Max
80 ns
80 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FAST PAGE DRAM
FAST PAGE DRAM
Memory Width
4
4
Number of Terminals
20
20
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX4
256KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20(UNSPEC)
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Standby Current-Max
0.001 A
0.001 A
Supply Current-Max
0.062 mA
0.06 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
No
Access Mode
FAST PAGE
Additional Feature
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
Length
24.56 mm
Number of Functions
1
Number of Ports
1
Operating Mode
ASYNCHRONOUS
Seated Height-Max
4.65 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Pitch
2.54 mm
Width
7.62 mm
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