MB81C1001-12LC vs KM41C1000CLP-8 feature comparison

MB81C1001-12LC FUJITSU Semiconductor Limited

Buy Now Datasheet

KM41C1000CLP-8 Samsung Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SAMSUNG SEMICONDUCTOR INC
Package Description DIP, DIP, DIP18,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode NIBBLE FAST PAGE
Access Time-Max 120 ns 80 ns
Additional Feature RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code R-CDIP-T18 R-PDIP-T18
Length 22.86 mm 22.02 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type NIBBLE MODE DRAM FAST PAGE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX1 1MX1
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Seated Height-Max 5.08 mm 4.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 18
I/O Type SEPARATE
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP18,.3
Standby Current-Max 0.0002 A
Supply Current-Max 0.06 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare MB81C1001-12LC with alternatives

Compare KM41C1000CLP-8 with alternatives