MB71A38-35MSK vs N82LHS191N feature comparison

MB71A38-35MSK FUJITSU Semiconductor Limited

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N82LHS191N Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC PHILIPS SEMICONDUCTORS
Package Description DIP, DIP, DIP24,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDIP-T24 R-PDIP-T24
Length 29.72 mm
Memory Density 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 2KX8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.36 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP24,.6
Supply Current-Max 0.11 mA
Terminal Finish Tin/Lead (Sn/Pb)

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