MB7132LWZ
vs
63RS881AJSXXXX
feature comparison
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
80 ns
|
|
| JESD-30 Code |
R-GDIP-T24
|
|
| Length |
31.78 mm
|
|
| Memory Density |
8192 bit
|
|
| Memory IC Type |
OTP ROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
|
| Number of Words |
1024 words
|
|
| Number of Words Code |
1000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
1KX8
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.84 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
2
|
|
|
|
|
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