MB7132EWZ
vs
MB7132EZ
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
FUJITSU LTD
|
Package Description |
DIP,
|
DIP, DIP24,.6
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
55 ns
|
120 ns
|
JESD-30 Code |
R-GDIP-T24
|
R-XDIP-T24
|
Length |
31.78 mm
|
|
Memory Density |
8192 bit
|
524288 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
1KX8
|
64KX8
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.84 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP24,.6
|
Supply Current-Max |
|
0.175 mA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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