MB7132EWZ vs MB7132EZ feature comparison

MB7132EWZ FUJITSU Semiconductor Limited

Buy Now Datasheet

MB7132EZ FUJITSU Limited

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC FUJITSU LTD
Package Description DIP, DIP, DIP24,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 120 ns
JESD-30 Code R-GDIP-T24 R-XDIP-T24
Length 31.78 mm
Memory Density 8192 bit 524288 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 1024 words 1024 words
Number of Words Code 1000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1KX8 64KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 2 2
Rohs Code No
Part Package Code DIP
Pin Count 24
JESD-609 Code e0
Package Equivalence Code DIP24,.6
Supply Current-Max 0.175 mA
Terminal Finish Tin/Lead (Sn/Pb)

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