MB7116HM
vs
M38510/20403BEA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
250 ns
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
JESD-609 Code
e0
Memory Density
2048 bit
4194304 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
4
16
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
512 words
512 words
Number of Words Code
512
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
512X4
256KX16
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.12 mA
0.02 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
BIPOLAR
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
4
Screening Level
MIL-M-38510 Class B
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