MB507P vs MB504M feature comparison

MB507P FUJITSU Limited

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MB504M FUJITSU Semiconductor Limited

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 8
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family ECL
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.4 mm 9.4 mm
Load Capacitance (CL) 12 pF
Number of Data/Clock Inputs 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-EMITTER
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.36 mm 4.36 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
fmax-Min 1600 MHz 520 MHz
Base Number Matches 5 1

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