MB40C568HPF
vs
MB40C568HPF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP24,.3
|
SOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
4 V
|
4 V
|
| Analog Input Voltage-Min |
0.5 V
|
0.5 V
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
15.24 mm
|
15.24 mm
|
| Linearity Error-Max (EL) |
0.3%
|
0.3%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
30 MHz
|
30 MHz
|
| Seated Height-Max |
2.25 mm
|
2.25 mm
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.3 mm
|
5.3 mm
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
No
|
|
|
|